The Sigrity solutions have been divided in modules for Signal Integrity (SI) and Power Integrity (PI). Below you will find a summary of these modules.

OptimizePI

     Automated board and IC package decap optimization
     that considers both target impedance and cost. 
     The result is decap savings of 20 - 50% with equal or
     better performance.

PowerDC

     Efficient and accurate IR drop analysis and DRC sign-off
     solution to rapidly identify ideal sense line location,
     voltage drops and current hot-spots for IC packages and
     printed circuit boards.

PowerSI

     Advanced signal and power integrity analysis including
     S-parameter extraction with visualization of spatial
     relationships for entire IC package and printed circuit
     board structures.

SPEED2000

     Groundbreaking solution for time domain electromagnetic
     simulation of an entire IC package or printed circuit board
     for comprehensive signal and power integrity analysis
     with a single tool.